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atmel- 8859a-seeprom-at24cs16-datahseet-022013 standard features ? low-voltage operation ? v cc = 1.7v to 5.5v ? internally organized as 2,048 x 8 (16kb) ? i 2 c-compatible (2-wire) serial interface ? schmitt trigger, filtered inputs for noise suppression ? bidirectional data transfer protocol ? 400khz (1.7v) and 1mhz (2.5v, 5.0v) compatibility ? write protect pin for hardware data protection ? 16-byte page write mode ? partial page writes allowed ? self-timed write cycle (5ms max) ? high-reliability ? endurance: 1,000,000 write cycles ? data retention: 100 years ? green package options (pb/halide-free/rohs-compliant) ? 8-lead jedec soic, 8-lead tssop, 8-pad udfn, and 5-lead sot23 ? die sale options: wafer form and tape and reel available enhanced features in the cs serial eeprom series ? all standard features supported ? 128-bit unique factory-programmed serial number ? permanently locked, read-only value ? stored in a separate memory area ? guaranteed unique across entire cs series of serial eeproms atmel at24cs16 i 2 c-compatible (2-wire) serial eeprom with a unique, factory programmed 128-bit serial number 16-kbit (2,048 x 8) preliminary datasheet
2 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 1. description the atmel ? at24cs16 provides 16,384 bits of serial electrically erasable and programmable read-only memory (eeprom) organized as 2,048 words of eight bits each. the device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. the at24cs16 is available in space-saving, 8-lead jedec soic, 8-lead tssop, 8-pad udfn, and 5-lead sot23 packages and is accessed via a 2-wire serial interface. additionally, this device supports full operation from 1.7v to 5.5v. the at24cs16 provides the additional feature of a factory programmed, guaranteed unique 128-bit serial number, while maintaining all of the traditional features available in the 16kb serial eeprom. the time consuming step of performing and ensuring true serialization of product on a manufacturing line can be removed from the production flow by employing the cs series serial eeprom. the 128-bit serial number is programmed and permanently locked from future writing during the atmel production process. further, this 128-bit location does not consume any of the user read/write area of the 16kb serial eeprom. the uniqueness of the serial number is guaranteed across the entire cs series of serial eeproms, regardless of the size of the memory array or the type of interface protocol. this means that as an application's needs for memory size or interface protocol evolve in future generations, any previously deployed serial number from any atmel cs series serial eeprom part will remain valid. 2. pin descriptions and pinout figure 2-1. pin configuration pin name function nc no connect sda serial data scl serial clock input wp write protect gnd ground v cc power supply 1 2 3 4 8 7 6 5 nc nc nc gnd v cc wp scl sda 8-lead soic 1 2 3 5 4 scl gnd sda wp v cc 5-lead sot23 1 2 3 4 8 7 6 5 v cc wp scl sda nc nc nc gnd 8-pad udfn bottom view 1 2 3 4 8 7 6 5 nc nc nc gnd v cc wp scl sda 8-lead tssop
3 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 3. absolute maximum ratings* 4. block diagram figure 4-1. block diagram operating temperature ........................?55 ? c to +125 ? c storage temperature ...........................?65 ? c to +150 ? c voltage on any pin with respect to ground .............................?1.0v to +7.0v maximum operating voltage ................................. 6.25v dc output current................................................ 5.0ma *notice: stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. start stop logic data word addr/counter row decoder device address comparator data latches d out / ack logic column decoder eeprom array serial control logic high voltage pump & timing 128-bit serial number serial mux read read/write enable comp load inc v cc gnd wp scl sda d out d in a 2 a 1 a 0
4 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 5. pin description serial clock (scl): the scl input is used to positive edge clock data into each eeprom device and negative edge clock data out of each device. serial data (sda): the sda pin is bidirectional for serial data transfer. this pin is open-drain driven and may be wire-ored with any number of other open-drain or open-collector devices. device/page addresses: the at24cs16 does not utilize device address pins, which limits the number of devices on a single bus to one. write protect (wp): at24cs16 has a write protect (wp) pin that provides hardware data protection. when the write protect pin is connected to ground (gnd), normal read/write operations to the full array are possible. when the write protect pin is connected to v cc , all write operations to the memory are inhibited but read operations are still possible. this operation is summarized in table 5-1 below. table 5-1. write protect wp pin status part of the array protected at24cs16 at v cc full array at gnd normal read/write operations
5 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 6. memory organization atmel at24cs16, 16k serial eeprom: internally organized with 128 pages of 16 bytes each, the 16k requires an 11-bit data word address for random word addressing. table 6-1. pin capacitance (1) note: 1. this parameter is characterized and is not 100% tested. table 6-2. dc characteristics note: 1. v il min and v ih max are reference only and are not tested. applicable over recommended operating range from t a = 25c, f = 1.0mhz, v cc = 5.5v symbol test condition max units conditions c i/o input/output capacitance (sda) 8 pf v i/o = 0v c in input capacitance (a 0 , a 1 , a 2 , scl) 6 pf v in = 0v applicable over recommended operating range from: t ai = -40 ? c to +85 ? c, v cc = 1.7v to 5.5v (unless otherwise noted) symbol parameter test condition min typ max units v cc supply voltage 1.7 5.5 v i cc1 supply current v cc = 5.0v read at 400khz 0.4 1.0 ma i cc2 supply current v cc = 5.0v write at 400khz 2.0 3.0 ma i sb1 standby current v cc = 1.7v v in = v cc or v ss 1.0 a i sb2 standby current v cc = 5.5v v in = v cc or v ss a i li input leakage current v in = v cc or v ss 0.10 3.0 a i lo output leakage current v out = v cc or v ss 0.05 3.0 a v il input low level (1) ?0.6 v cc x 0.3 v v ih input high level (1) v cc x 0.7 v cc + 0.5 v v ol1 output low level v cc = 1.7v i ol = 0.15ma 0.2 v v ol2 output low level v cc = 3.0v i ol = 2.1ma 0.4 v
6 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 table 6-3. ac characteristics note: 1. this parameter is ensured by characterization only. applicable over recommended operating range from t ai = ? 40 ? c to +85 ? c, v cc = 1.7v to 5.5v, cl = 1ttl gate and 100pf (unless otherwise noted) symbol parameter 1.7v 2.5v, 5.0v units min max min max f scl clock frequency, scl 400 1000 khz t low clock pulse width low 1.2 0.4 s t high clock pulse width high 0.6 0.4 s t i noise suppression time 100 50 ns t aa clock low to data out valid 0.1 0.9 0.05 0.55 s t buf time the bus must be free before a new transmission can start 1.3 0.5 s t hd.sta start hold time 0.6 0.25 s t su.sta start setup time 0.6 0.25 s t hd.dat data in hold time 0 0 s t su.dat data in setup time 100 100 ns t r inputs rise time (1) 0.3 0.3 s t f inputs fall time (1) 300 100 ns t su.sto stop setup time 0.6 0.25 s t dh data out hold time 50 50 ns t wr write cycle time 5 5 ms endurance (1) 3.3v, +25 ? c, page mode 1,000,000 write cycles
7 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 7. device operation clock and data transitions: the sda pin is normally pulled high with an external device. data on the sda pin may change only during scl low time periods (see figure 7-4 on page 9 ). data changes during scl high periods will indicate a start or stop condition as defined below. start condition: a high-to-low transition of sda with scl high is a start condition which must precede any other command (see figure 7-5 on page 9 ). stop condition: a low-to-high transition of sda with scl high is a stop condition. after a read sequence, the stop command will place the eeprom in a standby power mode (see figure 7-5 on page 9 ). acknowledge: all addresses and data words are serially transmitted to and from the eeprom in 8-bit words. the eeprom sends a zero to acknowledge that it has received each word. this happens during the ninth clock cycle (see figure 7-6 on page 9 ). standby mode: the at24cs16 features a low-power standby mode which is enabled upon power-up as well as after the receipt of the stop bit and the completion of any internal operations. 2-wire software reset: after an interruption in protocol, power loss, or system reset, any 2-wire part can be reset by following these steps: 1. create a start bit condition. 2. clock nine cycles. 3. create another start bit followed by stop bit condition as shown in figure 7-1 . the device is ready for next communication after above steps have been completed. figure 7-1. software reset scl 9 start bit start bit stop bit 8 3 2 1 sda dummy clock cycles
8 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 figure 7-2. bus timing scl: serial clock, sda: serial data i/o figure 7-3. write cycle timing scl: serial clock, sda: serial data i/o note: 1. the write cycle time t wr is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. scl sda in sda out t f t high t low t low t r t aa t dh t buf t su.sto t su.dat t hd.dat t hd.sta t su.sta t wr (1) stop condition start condition word n scl sda 8 th bit ack
9 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 figure 7-4. data validity figure 7-5. start and stop definition figure 7-6. output acknowledge sda scl data stable data stable data change sda scl start stop scl data in data out start acknowledge 9 8 1
10 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 8. device addressing standard eeprom access: the 16k eeprom device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation. the device address word consists of a mandatory ?1010? (ah) sequence for the first four most significant bits as shown in figure 10-1 on page 12 . this is common to all serial eeprom devices. the next three bits are used for memory page addressing and are the most significant bits of the data word address which follows. the eighth bit of the device address is the read/write operation select bit. a read operation is initiated if this bit is high, and a write operation is initiated if this bit is low. upon a valid compare of the device address, the eeprom will output a zero. if a compare is not successfully made, the chip will return to a standby state. serial number access: the at24cs16 utilizes a separate memory block containing a factory programmed 128-bit serial number. access to this memory location is obtained by beginning the device address word with a ?1011? (bh) sequence. due to the size of the serial number, the next three bits of the device address must be set to zero to gain access to the serial number. the eighth bit of the device address needs be set to a one to read the serial number. a zero in this bit position, other than during a dummy write sequence to set the address pointer, will result in a unknown data read from the part. writing or altering the 128-bit serial number is not possible. further specific protocol is needed to read the serial number from of the device. see read operations on page 11 for more details on accessing the special feature. 9. write operations byte write: a byte write operation requires an 8-bit data word address following the device address word and acknowledgment. upon receipt of this address, the eeprom will again respond with a zero and then clock in the first 8-bit data word. following receipt of the 8-bit data word, the eeprom will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. at this time the eeprom enters an internally timed write cycle, t wr , to the nonvolatile memory. all inputs are disabled during this write cycle and the eeprom will not respond until the write is complete (see figure 10-2 on page 12 ). page write: the 16k eeprom are capable of an 16-byte page write. a page write is initiated in the same way as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. instead, after the eeprom acknowledges receipt of the first data word, the microcontroller can transmit up to 15 data words. the eeprom will respond with a zero after each data word received. the microcontroller must terminate the page write sequence with a stop condition (see figure 10-3 on page 12 ). the data word address lower four bits are internally incremented following the receipt of each data word. the higher data word address bits are not incremented, retaining the memory page row location. when the internally generated word address reaches the page boundary, the subsequent byte loaded will be placed at the beginning of the same page. if more than 16 data words are transmitted to the eeprom, the data word address will roll-over and previously loaded data will be overwritten. acknowledge polling: once the internally timed write cycle has started and the eeprom inputs are disabled, acknowledge polling can be initiated. this involves sending a start condition followed by the device address word. the read/write bit is representative of the operation desired. only if the internal write cycle has completed will the eeprom respond with a zero allowing the next read or write sequence to begin.
11 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 10. read operations read operations are initiated in the same way as write operations with the exception that the read/write select bit in the device address word is set to one. there are four read operations: ? current address read ? random address read ? sequential read ? serial number read current address read: the internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. this address stays valid between operations as long as the chip power is maintained. the address roll-over during read is from the last byte of the last memory page to the first byte of the first page. the address roll-over during write is from the last byte of the current page to the first byte of the same page. once the device address with the read/write select bit set to one is clocked in and acknowledged by the eeprom, the current address data word is serially clocked out. the microcontroller does not respond with an zero but does generate a following stop condition (see figure 10-4 on page 12 ). random read: a random read requires a dummy byte write sequence to load in the data word address. once the device address word and data word address are clocked in and acknowledged by the eeprom, the microcontroller must generate another start condition. the microcontroller now initiates a current address read by sending a device address with the read/write select bit high. the eeprom acknowledges the device address and serially clocks out the data word. the microcontroller does not respond with a zero but does generate a following stop condition (see figure 10-5 on page 13 ). sequential read: sequential reads are initiated by either a current address read or a random address read. after the microcontroller receives a data word, it responds with an acknowledge. as long as the eeprom receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. when the memory address limit is reached, the data word address will roll-over and the sequential read will continue. the sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see figure 10-6 on page 13 ). serial number read: reading the serial number is similar to the sequential read sequence but requires use of the device address seen in figure 10-1 on page 12 , a dummy write, and the use of specific word address. note: the entire 128-bit value must be read from the starting address of the serial number block to guarantee a unique number. since the address pointer of the device is shared between the regular eeprom array and the serial number block, a dummy write sequence, as part of a random read or sequential read protocol, should be performed to ensure the address pointer is set to zero. a current address read of the serial number block is supported but if the previous operation was to the eeprom array, the address pointer will retain the last location accessed, incremented by one. reading the serial number from a location other than the first address of the block will not result in a unique serial number. additionally, the word address must begin with a ?10? sequence regardless of the intended address. if a word address other than ?10? is used, then the device will output undefined data. example: if the application desires to read the first byte of the serial number, the word address input would need to be 80h. when the end of the 128-bit serial number is reached (16 bytes of data), the data word address will roll-over back to the beginning of the 128-bit serial number. the serial number read operation is terminated when the microcontroller does not respond with an zero (ack) and instead issues a stop condition (see figure 10-7 on page 13 ).
12 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 figure 10-1. device address figure 10-2. byte write figure 10-3. page write figure 10-4. current address read density access area bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 16k eeprom 1 0 1 0 p2 p1 p0 r/ w serial number 1 0 1 1 0 0 0 1 msb lsb s t a r t s t o p w r i t e device address word address data sda line m s b r / w a c k a c k a c k s t a r t s t o p w r i t e device address sda line word address (n) data (n) data (n + 1) data (n + x) m s b r / w a c k a c k a c k a c k a c k device address data s t a r t r e a d s t o p sda line m s b r / w a c k n o a c k
13 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 figure 10-5. random read figure 10-6. sequential read figure 10-7. serial number read sda line s t a r t w r i t e s t a r t r e a d s t o p device address word address (n) device address data (n) dummy write m s b r / w a c k n o a c k a c k a c k r / w a c k a c k a c k a c k n o a c k sda line r e a d s t o p device address data (n + x) data (n + 2) data (n + 1) data (n) sda line device address word address n device address s t a r t w r i t e s t a r t r e a d a c k a c k a c k a c k r / w 1 0 1 1 0 0 0 1 0 0 0 0 0 0 0 1 0 1 1 0 0 0 m s b dummy write serial number data byte 0x0 serial number data byte 0x1 serial number data byte 0x2 serial number data byte 0x3 serial number data byte 0xf n o a c k s t o p
14 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 11. part markings drawing no. rev. title catalog number truncation at24cs16 truncation code ###: na package mark contact: dl-cso-assy_eng@atmel.com 24cs16sm a 1/22/13 24cs16sm, at24cs16 package marking information date codes voltages y = year m = month ww = work week of assembly m: 1.7v min 3: 2013 7: 2017 a: january 02: week 2 4: 2014 8: 2018 b: february 04: week 4 5: 2015 9: 2019 ... ... 6: 2016 0: 2020 l: december 52: week 52 country of assembly lot number grade/lead finish material @ = country of assembly aaa...a = atmel wafer lot number u: industrial/matte tin h: industrial/nipdau trace code atmel truncation xx = trace code (atmel lot numbers correspond to code) at: atmel example: aa, ab.... yz, zz atm: atmel atml: atmel aaaaaaaa na m @ atmlhyww 8-lead soic 8-lead tssop aaaaaaa na m @ athyww 8-lead udfn na hm@ yxx 2.0 x 3.0 mm body 5-lead sot-23 na mu ymxx bottom mark top mark note 2: package drawings are not to scale note 1: designates pin 1 at24cs16: package marking information
15 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 12. ordering code detail atmel designator product family device density shipping carrier option operating voltage 16 = 16k 24cs = serial eeprom, with 128-bit serial number feature t = tape and reel m = 1.7v to 5.5v package device grade or wafer/die thickness h = green, nipdau lead finish, industrial temperature range (-40?c to +85?c) u = green, matte sn lead finish, industrial temperature range (-40?c to +85?c) 11 = 11mil wafer thickness package option ss = jedec soic x = tssop ma = udfn st = sot23 wwu = wafer unsawn at24cs16-sshm-t
16 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 13. ordering information 13.1 atmel at24cs16 ordering information additional package types that are not listed may be available. please contact atmel for more details. notes: 1. consistent with the general semiconductor market trend, atmel will supply devices with either gold or copper bond wires to increase manufacturing flexibility and to ensure a long-term continuity of supply. there is no difference in product quality, reliability, or performance between the two variations. 2. t = tape and reel ? soic = 4k units per reel ? tssop, udfn, and sot23 = 5k units per reel 3. for wafer sales, please contact atmel sales. atmel ordering code (1) package lead finish voltage operation range at24cs16-sshm-t (2) 8s1 nipdau (lead-free/halogen-free) 1.7v to 5.5v industrial temperature (?40 ? c to 85 ? c) at24cs16-xhm-t (2) 8x at24cs16-mahm-t (2) 8ma2 at24cs16-stum-t (2) 5ts1 matte tin (lead-free/halogen-free) at24cs16-wwu11m (3) wafer sale package type 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8x 8-lead, 4.4mm body, plastic thin shrink small outline (tssop) 8ma2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, dual no lead (udfn) 5ts1 5-lead, 2.90mm x 1.60mm body, plastic thin shrink small outline (sot23)
17 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 14. packaging information 14.1 8s1 ? 8-lead jedec soic drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note a1 0.10 ? 0.25 a 1.35 ?1.75 b 0.31 ?0.51 c 0.17 ? 0.25 d 4.80 ? 5.05 e1 3.81 ? 3.99 e 5.79 ?6.20 e 1.27 bsc l 0.40 ?1.27 0? ? 8 e 1 n top view c e1 end view a b l a1 e d side view package drawing contact: packagedrawings@atmel.com 8s1 g 6/22/11 notes: this drawing is for general information only. refer to jedec drawing ms-012, variation aa for proper dimensions, tolerances, datums, etc. 8s1, 8-lead (0.150?wide body), plastic gull wing small outline (jedec soic) swb
18 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 14.2 8x ? 8-lead tssop drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note a - - 1.20 a1 0.05 - 0.15 a2 0.80 1.00 1.05 d 2.90 3.00 3.10 2, 5 e 6.40 bsc e1 4.30 4.40 4.50 3, 5 b 0.19 ? 0.30 4 e 0.65 bsc l 0.45 0.60 0.75 l1 1.00 ref c 0.09 - 0.20 side view end view top view a2 a l l1 d 1 e1 n b pin 1 indicator this corner e e notes: 1. this drawing is for general information only. refer to jedec drawing mo-153, variation aa, for proper dimensions, tolerances, datums, etc. 2. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. dimension e1 does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. dambar cannot be located on the lower radius of the foot. minimum space between protrusion and adjacent lead is 0.07 mm. 5. dimension d and e1 to be determined at datum plane h. h package drawing contact: packagedrawings@atmel.com 8x e 12/8/11 8x, 8-lead 4.4mm body, plastic thin shrink small outline package (tssop) tnr c a1
19 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 14.3 8ma2 ? 8-pad udfn title drawing no. gpc rev. package drawing contact: packagedrawings@atmel.com 8ma2 ynz c 8ma2, 8-pad, 2 x 3 x 0.6 mm body, thermally enhanced plastic ultra thin dual flat no lead package (udfn) common dimensions (unit of measure = mm) symbol min nom max note d 1.90 2.00 2.10 e 2.90 3.00 3.10 d2 1.40 1.50 1.60 e2 1.20 1.30 1.40 a 0.50 0.55 0.60 a1 0.0 0.02 0.05 a2 0.55 c 0.152 ref l 0.30 0.35 0.40 e 0.50 bsc b 0.18 0.25 0.30 3 k 0.20 ? 9/6/12 d2 e2 e e (6x) l (8x) b (8x) pin#1 id a a1 a2 pin 1 id d c k 8 7 6 5 1 2 3 4 1 2 3 4 8 7 6 5
20 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 14.4 5ts1 ? 5-lead sot23 drawing no. rev. title gpc package drawing contact: packagedrawings@atmel.com 5ts1 d 5/31/12 5ts1, 5-lead 1.60mm body, plastic thin shrink small outline package (shrink sot) tsz common dimensions (unit of measure = mm) symbol min nom max note a - - 1.00 a1 0.00 - 0.10 a2 0.70 0.90 1.00 c 0.08 - 0.20 3 d 2.90 bsc 1,2 e 2.80 bsc 1,2 e1 1.60 bsc 1,2 l1 0.60 ref e 0.95 bsc e1 1.90 bsc b 0.30 - 0.50 3,4 1. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 mm per end. dimension e1 does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.15 mm per side. 2. the package top may be smaller than the package bottom. dimensions d and e1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. these dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 4. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. the dambar cannot be located on the lower radius of the foot. minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. this drawing is for general information only. refer to jedec drawing mo-193, variation ab for additional information. 5 4 2 l1 l c end view c a a2 a1 b e plane seating d side view e e1 e1 3 1 top view
21 atmel at24cs16 [preliminary datasheet] atmel-8859a-seeprom-at24cs16-datasheet-022013 15. revision history doc. rev. date comments 8859a 02/2013 initial document release.
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